200mm (8″) Vertical Batch Transfer with Aligner
The VBT200A (Vertical Batch Transfer and Notch Alignment machine) is a single stage, automated tool that can transfer a batch of 200mm wafers between semi-standard cassettes and align a batch of 200mm wafers by the notch.
Wafers are always handled on the edge and detection sensors check for wafer safety during the transfer and alignment processes. Wafers are aligned using the heavily industrialized alignment technology developed by Recif Technologies, used in the multiple standalone and OEM systems The VBT200A provides true ESD protection for wafers and carriers.
The angle of alignment can be easily selected through the user-friendly keypad.
Cassette mapping can be offered on request.
VBT200A provides multiple functions within an incredibly small footprint and at an extremely competitive price.
VBT can be supplied for batch transfer of wafers between Semi-standard cassettes and Quartz Boats.
VBT is compatible with various substrate materials including Silicon Carbide (SiC) and Gallium Nitride (GaN).